Development of wafer warpage measurement technique using Moire method
碩士 === 國立臺灣科技大學 === 機械工程系 === 102 === A non-contact warpage measurement technique by using the Moire effect method is proposed in this study. The technique is simple and easy to set up. It consists of a light source, a linear grating, a Charge-coupled Device (CCD) camera, a beam-splitter, and a focu...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/66870959175439593807 |