K band PCB-to-LTCC BGA transition compensationand V band LTCC-to-LTCC flip-chip transition design
碩士 === 國立臺灣大學 === 電信工程學研究所 === 102 === This thesis is divided into two parts: firstly, it is about BGA (ball grid array) transition compensation design with hi-low impedance. The connections between PCB and LTCC (low temperature co-fired ceramic) substrate are made by reflow of solder balls. Microst...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/44891204214553388711 |