Interfacial Reactions Between Cu Substrates and Lead Free Solder for 3D IC Applications
碩士 === 國立臺灣大學 === 材料科學與工程學研究所 === 102 === Semiconductor industry has been guided by Moore’s law in the past 50 years. However, smaller size and better functionality of electronic devices is now forcing Moore’s law to face its imminent limitation. As a result, 3-Dimensional Integrated Circuit (3D IC)...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/90864045039428487575 |