Effects of Minor Ti, Mn, and Zn Additions on SnAg Solder Joints – Sn Grain Refinement and Interfacial Reactions
碩士 === 國立臺灣大學 === 材料科學與工程學研究所 === 102 === SnAg and SnAgCu alloys are widely used in electronic packaging industry. Recently, Sn’s anisotropic properties have been widely reported. Several researchers reported that the interstitial diffusions of Cu and Ni along c-axis of Sn grains are much faste...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2014
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/89544889510726641791 |