Research and development of materials system with thermodynamic equilibrium for SOFC interconnect application
碩士 === 國立清華大學 === 材料科學工程學系 === 102 === The present study focuses on developing a materials system for the SOFC interconnect application. This study has utilized a low thermal expansion material HRA929 as the substrate and designed a coating composition based on CALPHAD-based phase diagram simulation...
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| Format: | Others |
| Language: | en_US |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/zfpcr8 |