Thermo-mechanical Finite Element Model in BGA Solder Joints Fatigue Life Analysis
碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 102 === As the microelectronic package develops technologies for fabrication smaller, faster and economical, thermal management play an important role. Temperature variation caused by either environmental changes or power consumption, and the coefficient of therma...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/nx2v84 |