Reliability of Cu pillar bump under cyclic thermal loading
碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 102 === The thesis is to find out the longest fatigue life of the flip chip ball grid array (FCBGA) package by changing the geometry of copper pillar bump. The probability of failure of the package due to fatigue damage is then greatly reduced. The fatigue damage o...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/54180358733128471286 |