A Study of the Co-development of High Thermo-Resistant Substrate and Debonding Processes
碩士 === 國立中山大學 === 高階經營碩士班 === 102 === Currently Taiwan’s major panel makers have invested related R&;D resources. However, no domestic suppliers can stably provide PI material for making flex substrates of AMOLED, especially for high-resolution with high-temperature withstanding, like LTPS(Low T...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/rjkaq2 |