Design and Implementation of A Scalable Test Moduleto Support 3D IC Testing
碩士 === 國立中山大學 === 電機工程學系研究所 === 102 === This thesis presents a new test architecture based on 3D IC stacking stage, called scalable test module (STM). STM will be fabricated a separate die and integrated with dies unde test (DUT) to address the test access problem of 3D IC with low test cost. STM is...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/04506589780539241977 |