The study for using Copper Net to Change Target Bonding Force

• Main Authors: Chao-Wei Liu, 劉兆蔚
• Other Authors: Chi-Chang Hsieh
• Format: Others
• Language: zh-TW
• Published: 2014
• Online Access: http://ndltd.ncl.edu.tw/handle/60530327376147994797

碩士 === 國立高雄第一科技大學 === 機械與自動化工程研究所 === 102 === In this study, the standard process used in target bonding was enhanced; the bonding process in support wire of a switch from copper net, to improve the process without affecting the target bonding rate. Using this method can not only reduce the amount of cement required, but also enhance the bonding strength of the target. Six copper were used in three set overlapping ways bonding test, which changed two bonding process, the original support line switch from copper net, and the use of volume reduction of copper net to amount of adhesive. After completing the bonding, a C-SCAN machine was used to detect the bonding rate. The samples were stretched using a cupping machine test to verify the maximal tensile strength obtained using the proposed method. The developed process enhanced the tensile strength of the samples by 5% and reduced the amount of cement required, reducing the costs of the process by more than 50%