The study for using Copper Net to Change Target Bonding Force
碩士 === 國立高雄第一科技大學 === 機械與自動化工程研究所 === 102 === In this study, the standard process used in target bonding was enhanced; the bonding process in support wire of a switch from copper net, to improve the process without affecting the target bonding rate. Using this method can not only reduce the amount o...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/60530327376147994797 |