Optimal Parameters Design Of Plasma Treatment Pre-Underfill For Flip Chip Device
碩士 === 國立高雄第一科技大學 === 機械與自動化工程研究所 === 102 === In this thesis, focusing on high-end IC packaging products - stacked flip chip scale package (STKFCCSP), for plasma processing parameters to make the best of a study on the bottom after plasma treatment and plasma treatment gel glue width angle drops aft...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/60907347489372657474 |