The Research of Semiconductor Flip Chip Packaging Process and Sealant Technology
碩士 === 國立高雄海洋科技大學 === 微電子工程研究所 === 102 === In the era of everchanging semiconductor techonology,smart phones have already been very popular in people’s lives.The users of the product often accidentally break their phones by falling due to carelessness or some other unexpected conditions.This kind of...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/98ayjy |