Analysis of uniform temperature distribution in MOCVD susceptor by high frequency RF induction heater

• Main Authors: Jin-Fu Lu, 盧勁甫
• Other Authors: Tomi Li
• Format: Others
• Language: zh-TW
• Published: 2014
• Online Access: http://ndltd.ncl.edu.tw/handle/97286261120149038744

碩士 === 國立中央大學 === 能源工程研究所 === 102 === This study uses the numerical analysis to simulate the high frequency RF induction heating for MOCVD susceptor, the phenomenon of electromagnetic induction heating and distribution of temperature on the susceptor are investigated. Using numerical analysis calculates the 2D axisymmetric model with phenomenon of electromagnetic induction heating in MOCVD susceptor, the research indicates the temperature difference is decreased with increasing space of coil turns and the temperature difference will decrease with the distance between coil and susceptor, and then the space of coil turn is fixed at 0.8 cm with adjusting the distance between coil and susceptor in order to find the uniform temperature distribution on the deposition area of wafer. In this summary, it obtains the temperature difference is only 2.2 K on the deposition area of susceptor with the distance between individual coil and susceptor are 0.5cm, 0.7cm, 0.8cm, 0.5cm, 0.6cm and 0.7cm. Following the 2D axisymmetric model, the research further compares 2D model with 3D model in electromagnetic induction heating. In the 3D model, the result discovers that by twining coil mode which will result in different current density distribution in different positions of susceptor. The current density distribution decides the distribution of heat source. Because of the different distribution of heat source that will result in different temperature distribution on the susceptor. Consequently, by using the optimized arrangement of coil in 2D model and improving the arrangement of coil that the distance between individual coil and susceptor are 0.5cm, 0.5cm, 0.6cm, 0.6cm, 0.7cm and 0.8cm for obtaining the fine temperature distribution on the susceptor.