Bonding Characteristics of Co-sputtering Aluminum-Germanium Thin Film
碩士 === 國立中央大學 === 化學工程與材料工程學系 === 102 === In MEMS packaging, aluminum-germanium eutectic bonding can achieve excellent bonding strength and good hermetic performance. Under many circumstances, using bi-layer aluminum/germanium thin film is the most common bonding approach, however it requires time a...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/45526768176248673245 |