Acoustic Emission Monitoring and Quality Study of Ultrasonic Wire Bonding
碩士 === 國立交通大學 === 機械工程系所 === 102 === The ultrasonic wire bonding process probably causes fracture and failure of the optoelectronic and microelectronic devices. The wire bonding quality of the device depends on bonding parameters. In this thesis, acoustic emission technology was used to real-time mo...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/32390139934472334426 |