Development of viscoelastic constitutive model of epoxy molding compound and its application to package warpage simulation
碩士 === 國立成功大學 === 機械工程學系 === 102 === In this thesis, the viscoelastic behaviors of epoxy molding compound (EMC) and laminate substrate are characterized, and the corresponding constitutive models are developed and implemented in finite element simulations to predict warpage evolution of an overmolde...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/39219744042455362429 |