Characterization of 3-D Viscoelastic Behavior of Molding Compound and Application to Package-on-Package Warpage Simulation

Characterization of 3-D Viscoelastic Behavior of Molding Compound and Application to Package-on-Package Warpage Simulation

碩士 === 國立成功大學 === 機械工程學系 === 102 === In this thesis an experimental procedure for characterizing three-dimensional viscoelastic behavior of epoxy molding compound (EMC) is presented. By using both tensile and torsional dynamic mechanical analyses (DMA) and thermal mechanical analyses (TMA), the visc...

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Main Authors: Dong-YiHuang, 黃東藝
Other Authors: Tz-Cheng Chiu
Format: Others
Language:zh-TW
Published: 2014
Online Access:http://ndltd.ncl.edu.tw/handle/01053425011960576925
id ndltd-TW-102NCKU5489087
record_format oai_dc
spelling ndltd-TW-102NCKU54890872016-03-07T04:10:58Z http://ndltd.ncl.edu.tw/handle/01053425011960576925 Characterization of 3-D Viscoelastic Behavior of Molding Compound and Application to Package-on-Package Warpage Simulation 堆疊式封裝之封膠三維黏彈行為量測與翹曲模擬 Dong-YiHuang 黃東藝 碩士 國立成功大學 機械工程學系 102 In this thesis an experimental procedure for characterizing three-dimensional viscoelastic behavior of epoxy molding compound (EMC) is presented. By using both tensile and torsional dynamic mechanical analyses (DMA) and thermal mechanical analyses (TMA), the viscoelastic constitutive model of a low-filler-percentage EMC is developed. Finite element analyses incorporating the viscoelastic EMC constitutive behavior are conducted to simulate warpage evolution of a package-on-package (PoP) device during solder reflow process. The numerical results are compared to shadow Moiré warpage measurements for validating the constitutive model. Tz-Cheng Chiu 屈子正 2014 學位論文 ; thesis 96 zh-TW
collection NDLTD
language zh-TW
format Others
sources NDLTD
description 碩士 === 國立成功大學 === 機械工程學系 === 102 === In this thesis an experimental procedure for characterizing three-dimensional viscoelastic behavior of epoxy molding compound (EMC) is presented. By using both tensile and torsional dynamic mechanical analyses (DMA) and thermal mechanical analyses (TMA), the viscoelastic constitutive model of a low-filler-percentage EMC is developed. Finite element analyses incorporating the viscoelastic EMC constitutive behavior are conducted to simulate warpage evolution of a package-on-package (PoP) device during solder reflow process. The numerical results are compared to shadow Moiré warpage measurements for validating the constitutive model.
author2 Tz-Cheng Chiu
author_facet Tz-Cheng Chiu
Dong-YiHuang
黃東藝
author Dong-YiHuang
黃東藝
spellingShingle Dong-YiHuang
黃東藝
Characterization of 3-D Viscoelastic Behavior of Molding Compound and Application to Package-on-Package Warpage Simulation
author_sort Dong-YiHuang
title Characterization of 3-D Viscoelastic Behavior of Molding Compound and Application to Package-on-Package Warpage Simulation
title_short Characterization of 3-D Viscoelastic Behavior of Molding Compound and Application to Package-on-Package Warpage Simulation
title_full Characterization of 3-D Viscoelastic Behavior of Molding Compound and Application to Package-on-Package Warpage Simulation
title_fullStr Characterization of 3-D Viscoelastic Behavior of Molding Compound and Application to Package-on-Package Warpage Simulation
title_full_unstemmed Characterization of 3-D Viscoelastic Behavior of Molding Compound and Application to Package-on-Package Warpage Simulation
title_sort characterization of 3-d viscoelastic behavior of molding compound and application to package-on-package warpage simulation
publishDate 2014
url http://ndltd.ncl.edu.tw/handle/01053425011960576925
work_keys_str_mv AT dongyihuang characterizationof3dviscoelasticbehaviorofmoldingcompoundandapplicationtopackageonpackagewarpagesimulation
AT huángdōngyì characterizationof3dviscoelasticbehaviorofmoldingcompoundandapplicationtopackageonpackagewarpagesimulation
AT dongyihuang duīdiéshìfēngzhuāngzhīfēngjiāosānwéiniándànxíngwèiliàngcèyǔqiàoqūmónǐ
AT huángdōngyì duīdiéshìfēngzhuāngzhīfēngjiāosānwéiniándànxíngwèiliàngcèyǔqiàoqūmónǐ
_version_ 1718199634108612608

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