Characterization of 3-D Viscoelastic Behavior of Molding Compound and Application to Package-on-Package Warpage Simulation
碩士 === 國立成功大學 === 機械工程學系 === 102 === In this thesis an experimental procedure for characterizing three-dimensional viscoelastic behavior of epoxy molding compound (EMC) is presented. By using both tensile and torsional dynamic mechanical analyses (DMA) and thermal mechanical analyses (TMA), the visc...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/01053425011960576925 |