Effect of solder-ball pitch on the reliability of a thermally enhanced FC-PBGA assembly
碩士 === 國立成功大學 === 機械工程學系 === 102 === In recent years, due to the IC assembly and packaging technology is developing to small size, fine pitch and high density. In this paper, the effect of solder-ball pitch on the reliability of the thermally enhanced FC-PBGA (Flip-Chip Plastic Ball Grid Array) asse...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/67031051779626474860 |