A GPU-Assist Thermal Simulator Considering Thermal Frame Computing Load for Three Dimensional Integrated Circuits at Electronic System Level

碩士 === 國立成功大學 === 電機工程學系 === 102 === As the ever-increasing performance requirements of SOC and process technology scaling, the power density of system-on-a-chip (SOC) increases accordingly and creates high temperature on the chip. Since thermal issues have negative impacts on IC reliability and per...

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Bibliographic Details
Main Authors: Jie-YouLin, 林玠佑
Other Authors: Lih-Yih Chiou
Format: Others
Language:zh-TW
Published: 2014
Online Access:http://ndltd.ncl.edu.tw/handle/8syq83