The Study of improve Saw Wire Machine cost for Solar Process Using Experimental Methodology

• Main Authors: Cuo-XiangHong, 洪國翔
• Other Authors: Mau-Phon Houng
• Format: Others
• Language: zh-TW
• Published: 2014
• Online Access: http://ndltd.ncl.edu.tw/handle/7zugz5

碩士 === 國立成功大學 === 電機工程學系 === 102 === In this paper, the cutting cost of the solar Si is improved by using slurry mixed by SiC and PEG. The DS271 free-abrasive multi-wire saw machine is used to cutting wafer, and study the influence of different operating conditions (various slurry volume and cutting speed) on the wafer yield. In the experiment, the Mastersizer 2000 particle analyzer is used to measure the particle sizes (diameters). Furthermore, the SEM photos are used to examine the kerf before an after the cutting. The results show that when the yields are controlled in a tolerent standard value, the slurry cost can be obviosly saved, and hence the total cutting cost can be reduced.