The Study of improve Saw Wire Machine cost for Solar Process Using Experimental Methodology
碩士 === 國立成功大學 === 電機工程學系 === 102 === In this paper, the cutting cost of the solar Si is improved by using slurry mixed by SiC and PEG. The DS271 free-abrasive multi-wire saw machine is used to cutting wafer, and study the influence of different operating conditions (various slurry volume and cut...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/7zugz5 |