Investigation of MOCVD-TiN films on the integrity of sub-130nm W-plug process
碩士 === 國立成功大學 === 電機工程學系碩士在職專班 === 102 === In this study, the application and investigation of metal organic chemical vapor deposition (MOCVD) TiN films as the diffusion barrier layer of sub W-plug process was explored. MOCVD technique is favorable for the formation of TiN glue layers mainly due to...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/93687428055606683807 |