Microstructure Evolution of Sn-3.5wt%Ag Solder Alloy under Current Stressing
碩士 === 國立成功大學 === 材料科學及工程學系 === 102 === The ever decreasing device dimension and thus the increasing current density render electromigration an important concern in the reliability of solder joint. Investigations have been focused on the influence of current stressing on the performance of the solde...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/79146700902438185570 |