Interfacial stability and phase equilibria between the Au-Ge high-temperature Pb-free solder and Cu or Ni substrate

碩士 === 國立成功大學 === 材料科學及工程學系 === 102 === High-temperature materials are demanding for high-power electronics, so the material of soldering need to support the high temperature. Currently, Pb is proven to be harmful to the environment and human health, so the searching for high temperature lead-free s...

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Bibliographic Details
Main Authors: Ming-yuehTsai, 蔡明岳
Other Authors: Shih-Kang Lin
Format: Others
Language:zh-TW
Published: 2014
Online Access:http://ndltd.ncl.edu.tw/handle/89m66f