The Use of Taguchi Method for the Robust Parameters Design Problems from Integrated-Circuit Packaging Quality Inspection Process
碩士 === 國立成功大學 === 工程管理碩士在職專班 === 102 === (1)Package visual inspection plays an important role in the Integrated-Circuits（IC）and testing industry. This research investigates that package visual inspection with high device reliability, minimize operation time during retesting and save costs on investi...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/21014549365157165306 |