Discussion of the Failure at the Conducting Layer for Direct Chip Attach Package
碩士 === 國立成功大學 === 工程科學系 === 102 === In recent years, with the continuous progress and innovation of the electronic products progress, the requirements for frivolous short, high frequency, high speed and the high heat emission to the IC chip has increased. As a result, the flip chip and some similar...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/47329231332951484870 |