Study of external stress and electromigration effects on copper-tin intermetallic formation using bulge test

• Main Authors: Fang-Jui kuo, 郭芳瑞
• Other Authors: Ming-Tzer Lin
• Format: Others
• Language: zh-TW
• Published: 2014
• Online Access: http://ndltd.ncl.edu.tw/handle/45998010782740027372

碩士 === 國立中興大學 === 精密工程學系所 === 102 === A bulge test was performed to investigate the electromigration effects and the influence of external stress on the growth of Cu-Sn intermetallic compound (IMC) and surface microstructure. The pump and position sensor detector (PSD) were provided a constant load, and the bulge height was to maintain the stress on the specimens. On the other hand, the external stress experiment with electronic current was to investigate the electromigration effects on the surface microstructure of specimens. There are two conditions of this experiment. First, samples under temperature at 200?C for 12 hours with the tensile stress test were to find out the stress levels and aging time on the formation of intermetallic compounds (IMC). Second, samples under external stress and current density (104A/cm2) with different annealing temperature(100℃/200℃) were to find out the surface microstructure of specimens