Study of external stress and electromigration effects on copper-tin intermetallic formation using bulge test
碩士 === 國立中興大學 === 精密工程學系所 === 102 === A bulge test was performed to investigate the electromigration effects and the influence of external stress on the growth of Cu-Sn intermetallic compound (IMC) and surface microstructure. The pump and position sensor detector (PSD) were provided a constant load,...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/45998010782740027372 |