The Study of A Foreign Semiconductor Equipment Company’s Supportive Framework for Product-Service System in Taiwan – As An Example of Flip Chip Bonder

• Main Authors: Ming-Hsun Tu, 杜明勲
• Other Authors: 林谷合
• Format: Others
• Language: zh-TW
• Published: 2015
• Online Access: http://ndltd.ncl.edu.tw/handle/10254444114454509178

碩士 === 國立中興大學 === 高階經理人碩士在職專班 === 102 === The research mainly uses a support infrastructure of flip-chip bonder machine and products service system, to analysis the business context, PSS types, PSS characteristics with case Semiconductor Company, and follow the nine characteristics to research project by depth qualitative model, this application can help the products and services in systems analysis, in addition to explain the current business context, but also can find the right foundation for dramatic changes in the environment favorable to resolve their core deviation worries, not only because of their advantages in product, product characteristics should be the focus the service value. Insight reference product service system organized by the case of the semiconductor equipment company, understand the intangible service properties, according to the characteristics of the business system analysis, resource planning to the deepest restructuring, so that the whole operation can be more responsive to customer needs, complete gain market recognition, and architecture of the product high value-added services business operation models.