The Study of A Foreign Semiconductor Equipment Company’s Supportive Framework for Product-Service System in Taiwan – As An Example of Flip Chip Bonder
碩士 === 國立中興大學 === 高階經理人碩士在職專班 === 102 === The research mainly uses a support infrastructure of flip-chip bonder machine and products service system, to analysis the business context, PSS types, PSS characteristics with case Semiconductor Company, and follow the nine characteristics to research proje...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/10254444114454509178 |