Using Zinc Oxide as Intermediate Layer for Glass Metallization
碩士 === 國立中興大學 === 化學工程學系所 === 102 === For the chip packaging technology, the 2.5-dimensional / three-dimensional of the chip stacking technology is future-oriented packaging technology. The 2.5D/3D IC chip stacking technology is to connect chips in vertical integration, in this technology, interpose...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/35061264883604301959 |