The Electrochemical Study of NiW Alloy Electrodeposition for Filling Through Silicon Vias
碩士 === 國立中興大學 === 化學工程學系所 === 102 === After Damascus technology revolution, copper metallization and chemical mechanical polishing (CMP) technique replace the old process of aluminum metallization, which has led to a great industrial transformation. To meet the requirement of state-of-the-art electr...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/54029402143583909156 |