Analysis of improvement for forming solder crack nail foot frame encapsulation process
碩士 === 國立高雄應用科技大學 === 模具系碩士在職專班 === 102 === In this study, the effect of various forming angles on solder crack was investigated. Forming angles of 20o, 23 o and 25 o were used to from lead frames, and then optical microscopy and scanning electron microscopy were used to check the occurrence of sold...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/66896017307480001604 |