Laser-induced backside wet cleaning technique for wafers
碩士 === 華梵大學 === 機電工程學系 === 102 === The aimed of this paper is to propose an alternative technique of laser cleaning for silicon wafer. An Nd:YAG laser was applied from the backside of the wafer which is submerged in water. The laser energy induces shock wave in the wafer. The shock wave transmits in...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/21321070476107108443 |