Application of Taguchi Method in the Improvement of Chip Package Quality
碩士 === 逢甲大學 === 機械與電腦輔助工程學系 === 102 === This study focuses on quality improvement of the sealing line in chip packaging process. In this study, the indicator of sealing-line quality refers to the variation of film-withstand peeling force. The control variables include pressing temperature, pressing...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/73ggqw |