| Summary: | 碩士 === 逢甲大學 === 工業工程與系統管理學系 === 102 === Wafer Probing, known as Wafer Sort, is an important process which verifies the wafer yield after wafer fabrication in the semiconductor industry. A major feature of the semiconductor industry is its relatively high investment in equipment cost, about 2/3 of total costs in 8 inches wafer fabs and 3/4 of total costs in 12 inches wafer fabs. Besides, the Wafer Sort process is last process of wafer fabrication. It is easy to be influenced by the urgent order or uncertainty of wafer shipment from FAB, so now how to take the shipping of date (SOD) and equipment efficiency into consideration has become a challenging issue for Wafer Sort. In addition, the supervisor of Wafer Sort would allocate the equipment and schedule for balancing capacity under the limited resources in order to be ready for shipment on time. However, the unexpected incident might occur under this condition, and that is called dynamic events. When this kind of situation happened, the unexpected incident might have made the original production out of balance, or even delayed shipment delivery.
Previous studies have been conducted on the scheduling system of the dynamic events, but most of them have been focused on mathematical model. Hence, in order to improve production, the study are used the unexpected events as triggers to (a) establish a new scheduling system that could make supervisor forecast the extent of influence when the machine idles due to unexpected incident and (b) adjust the capacity or dispatching rule. The results showed that the new system were better than the original one.
|
|---|
