Wire Sag Study of Q-loop、S-loop and M-loop Bonds on Semiconductor Packaging
碩士 === 正修科技大學 === 機電工程研究所 === 102 === In semiconductor industry, they are looking forward to replacing the using of gold wire in the IC packaging due to the on-going rise of gold raw material. Owing the stability and reliability considerations, the substitutes are still inferior to gold wire. Theref...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/p7b7fm |