Simulation of Thermal Diffusion of Cu/Al Heat Spreader after Micro-arc Oxidation Treatment

• Main Authors: CHEN,WAN-YI, 陳萬益
• Other Authors: MA,KUANG-JEN
• Format: Others
• Language: zh-TW
• Published: 2014
• Online Access: http://ndltd.ncl.edu.tw/handle/80096181082880574117

碩士 === 中華大學 === 機械工程學系碩士班 === 102 === The smartphone has more functions and high speed web access that requires more energy and causes a noticeable heating. It is essential to develop a new material or technology to solve the heat dissipation problem. A simulation work on a Cu/Al composite treated by microarc oxidation (MAO) for smart phone heat spreader in a closed system was carried out in this study using COMSOL Multiphysics software. The total thickness of Cu/Al composite heat spreader was 0.4 mm and the emissivity of the MAO layer approached 0.9. The high thermal conductivity of Cu was favor to quickly achieve a uniform temperature spread over the entire heat plate. The conducted heat was transferred from Cu to Al plate, and was radiated to the surrounding circumference through the high emissivity MAO layer. The combination of high conductivity of Cu and high emissivity of MAO layer significantly improved the performance of the heat dissipation compared to a single Cu plate as the heat spreader. The best performance for heat dissipation was obtained when the thickness ratio of Cu /Al composite plate was 0.3 mm /0.1 mm .