Simulation of Thermal Diffusion of Cu/Al Heat Spreader after Micro-arc Oxidation Treatment
碩士 === 中華大學 === 機械工程學系碩士班 === 102 === The smartphone has more functions and high speed web access that requires more energy and causes a noticeable heating. It is essential to develop a new material or technology to solve the heat dissipation problem. A simulation work on a Cu/Al composite treated b...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/80096181082880574117 |