Studies on interfacial reactions of lead-free solder joints and electroless deposited diffusion barriers in the Bi2Te3-based thermoelectric system

碩士 === 國立中正大學 === 化學工程研究所 === 102 === Thermoelectric (TE) devices consist of many pairs of p- and n-type semiconductor elements, which are interconnected electrically by soldering technology. Bi2Te3-based alloys are the most popular thermoelectric materials. Sb and Se are usually alloyed to Bi2Te3-b...

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Bibliographic Details
Main Authors: Chun-Wei Chiu, 邱俊暐
Other Authors: Chao-Hong Wang
Format: Others
Language:zh-TW
Published: 2014
Online Access:http://ndltd.ncl.edu.tw/handle/632yph