Research in the Strength Improvement of Wire bonding in CMOS by Plasma Cleaning
碩士 === 國立臺北科技大學 === 材料及資源工程系研究所 === 101 === This study wishing to use the plasma cleaning technology that commonly used in IC packaging to the fragile CMOS IC package. In the experiments, in addition to proof of the plasma can effectively improve the strength of the wire bonding, and use the baffle...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/wnza89 |