A Rapid Quantitative Method Of Monitoring Organic Additives In Advanced Copper Electroplating
碩士 === 國立聯合大學 === 化學工程學系碩士班 === 101 === In this study, a new type of rapid and easy method simplify the quantitative of traditional analysis procedures of additives. we use copper plating recipes of acid cupric sulfate containing additives mixtures. The additives are used for electroplating which we...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/15327324158452344381 |