Research for QFD and FMEA application for raising substrate package design performance
碩士 === 國立高雄大學 === 亞太工商管理學系碩士班 === 101 === Abstract Substrate is an integral component of the various electronic products in our daily life. Being the carrier of the signal connection between the wafer and the PCB, substrate helps manufacture electronic products to meet customers’ needs through the...
Main Authors: | , |
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Other Authors: | |
Format: | Others |
Language: | zh-TW |
Published: |
2013
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Online Access: | http://ndltd.ncl.edu.tw/handle/39104036031310437994 |