Research for QFD and FMEA application for raising substrate package design performance

碩士 === 國立高雄大學 === 亞太工商管理學系碩士班 === 101 === Abstract Substrate is an integral component of the various electronic products in our daily life. Being the carrier of the signal connection between the wafer and the PCB, substrate helps manufacture electronic products to meet customers’ needs through the...

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Bibliographic Details
Main Authors: Chao-ching Huang, 黃詔卿
Other Authors: Kuen-Horng Lu
Format: Others
Language:zh-TW
Published: 2013
Online Access:http://ndltd.ncl.edu.tw/handle/39104036031310437994