Interfacial reaction of the Ni/Sn-xZn/Cu sandwich structure couples
碩士 === 國立臺灣科技大學 === 材料科學與工程系 === 101 === In this study, the Sn-Zn alloys were used as the solders because of its low cost and the melting point is closer to the conventional Sn-Pb solder. However, BGA and FC technology are two of the mainstreams applied to the electronic packaging widely, and the Ni...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/43631592900081581432 |