Reliability Analyses of Flip Chip Assembly with Micro-Solder Balls
碩士 === 國立臺灣大學 === 材料科學與工程學研究所 === 101 === In recent years, the development trend of electronic products gets higher order application, and the internal structure of products is more intense than ever. High density packaging technology of wafer level is a positive development. Micro solder ball used...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/23811275375843221748 |