Failure mechanisms of Cu-Al wedge bonding under electromigration test in insulated-gate bipolar transistor (IGBT) modules
碩士 === 國立清華大學 === 工程與系統科學系 === 101
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| Language: | en_US |
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2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/44843590268650273775 |
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ndltd-TW-101NTHU55930682015-10-13T22:29:57Z http://ndltd.ncl.edu.tw/handle/44843590268650273775 Failure mechanisms of Cu-Al wedge bonding under electromigration test in insulated-gate bipolar transistor (IGBT) modules 絕緣閘雙極性電晶體模組中之銅-鋁楔型打線在電遷移實驗下之破壞機制 楊宗翰 碩士 國立清華大學 工程與系統科學系 101 歐陽汎怡 2013 學位論文 ; thesis 126 en_US |
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NDLTD |
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en_US |
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Others
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NDLTD |
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碩士 === 國立清華大學 === 工程與系統科學系 === 101 |
| author2 |
歐陽汎怡 |
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歐陽汎怡 楊宗翰 |
| author |
楊宗翰 |
| spellingShingle |
楊宗翰 Failure mechanisms of Cu-Al wedge bonding under electromigration test in insulated-gate bipolar transistor (IGBT) modules |
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楊宗翰 |
| title |
Failure mechanisms of Cu-Al wedge bonding under electromigration test in insulated-gate bipolar transistor (IGBT) modules |
| title_short |
Failure mechanisms of Cu-Al wedge bonding under electromigration test in insulated-gate bipolar transistor (IGBT) modules |
| title_full |
Failure mechanisms of Cu-Al wedge bonding under electromigration test in insulated-gate bipolar transistor (IGBT) modules |
| title_fullStr |
Failure mechanisms of Cu-Al wedge bonding under electromigration test in insulated-gate bipolar transistor (IGBT) modules |
| title_full_unstemmed |
Failure mechanisms of Cu-Al wedge bonding under electromigration test in insulated-gate bipolar transistor (IGBT) modules |
| title_sort |
failure mechanisms of cu-al wedge bonding under electromigration test in insulated-gate bipolar transistor (igbt) modules |
| publishDate |
2013 |
| url |
http://ndltd.ncl.edu.tw/handle/44843590268650273775 |
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AT yángzōnghàn failuremechanismsofcualwedgebondingunderelectromigrationtestininsulatedgatebipolartransistorigbtmodules AT yángzōnghàn juéyuánzháshuāngjíxìngdiànjīngtǐmózǔzhōngzhītónglǚxiēxíngdǎxiànzàidiànqiānyíshíyànxiàzhīpòhuàijīzhì |
| _version_ |
1718077549577240576 |