Failure mechanisms of Cu-Al wedge bonding under electromigration test in insulated-gate bipolar transistor (IGBT) modules
碩士 === 國立清華大學 === 工程與系統科學系 === 101
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| Format: | Others |
| Language: | en_US |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/44843590268650273775 |