Study of thermomigration on lead-free micro bump in three-dimensional integrated circuits packaging
碩士 === 國立清華大學 === 工程與系統科學系 === 101 === In order to deal with the requirements of consumer electronic products, the package technology is currently transition from flip chip technology to three dimensional integrated circuits (3D ICs). Compared to flip chip technology, the bump height of microbumps i...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/86369048520593365554 |